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CNIT manufacturing -ability

  • Perfect manufacturing platform

    A wide range of device platforms covering different fields

    Competitive veneer and machine manufacturing services

    Trial production, mass production independent capacity, support fast and flexible demand response ability

  • Strong process capability and quality assurance

    High-end (25G signal rate,), complex (70000 PIN, 34-layer PCB), large size PCBA (1200*510mm)

    Rigid, flexible, soft and hard combination plate

    01005, large size BGA (150mm*150mm), 180mm length SMD and other types of device capability

    Complete end-to-end material and process quality data traceability

  • Flexible collaboration model

    CM, ODM, feed processing and other multi-mode production organization and manufacturing capacity

    OEM, full OEM, partial OEM, VMI, material co-management and other types of end-to-end collaboration

CNIT manufacturing - Single board

15 FUJI NXTIII AND GLOBAL MOUNT LINES

10 pallet wave soldering/selective wave soldering, plug-in repair soldering lines

Vitrox 810 EX/XLT、TRI 7600SIII 5DX/

Phoenix nanomelx 180 3D X-ray

Agilent 3070、Teradyne TSLX/Spectrum 88series、TRI MDA

5 UV/IR coating lines

CNIT manufacturing - Complete machine

Assembly

Equipped with an assembly line for an in-line small clean room,

From small cassette products to 2U/4U/6U/8U servers

Micro module/power distribution cabinet/integrated cabinet and other large rack products

Test

Self-developed test equipment and test scripts

Multi-point FT/ST can be configured on demand, and 1000 ST test bits are dedicated to server products

Support local deployment of customer test network, and provide real-time docking/uploading of test data

Reliability

Equipped with an assembly line for an in-line small clean room,

12 ESS test chambers, 1 HASA/HALT test chamber

Two 119㎡ 64㎡ independent aging rooms, supporting a temperature range of 40-90°C

CNIT manufacturing - Process

Project Ability
PCB Size Long 50 ~ 900mm
Width 50 ~ 600mm
Thick 0.508 ~ 6.0mm
PCBA Weight SMT ≤ 6kg
Patch Weight Device weight/Adsorption area ≤ 0.288g/mm²
Device maximum weight ≤ 255g
Size Minimum size 1005
Size range of machined components 0.25*0.125 mm² --102*102 mm²
Special Insert machine Maximum cartridge pressure (N) 98N
Pluggable devices VGA interface,USBSocket, pin, all kinds of shaped parts,DIMM, switch buttons, high-speed communication ports, network port connectors,PCIESocket etc
Maximum size of pluggable devices (L*W*H) 145mm*26mm*45mm
Plug-in accuracy tolerance (mm) ± 0.TestVeneer processComplete line configuration SPI, 3D AOI, AXIBoard functionICT: supports 7680 test points
MDA: supports 1280 test points
BSI: customizes test items and parameters according to customer requirements
FBT: customizes test items and parameters according to customer requirementsServer/Network products/Other productsFT/ST: Customized test items and parameters according to customer requirements
HASA: temperature -40℃~80℃, rapid temperature change up to 40℃/min, vibration frequency 20Grms
ESS: 9 sets, temperature -20℃~80℃, temperature change 10℃/min linear
ORT/Burn-in: A total of 2 sets, high temperature 40~55 degrees, according to customer needs to determine the test time

CNIT manufacturing - Quality

Cloud tip manufacturing - equipment

SMT production line has the most complete process/equipment configuration, using the industry's mainstream first-line brands, according to customer needs to set up product lines

 

 

Cloud tip manufacturing - equipment

  • Self-energy
    Bunker system

  • Auto
    Steel mesh
    Inspection machine

  • Brain power
    Nozzle
    Cleaning machine

  • Mount head
    Automatic
    Maintenance machine

  • X-RAY
    Material dispenser