CNIT manufacturing -ability
- Perfect manufacturing platform
A wide range of device platforms covering different fields
Competitive veneer and machine manufacturing services
Trial production, mass production independent capacity, support fast and flexible demand response ability
- Strong process capability and quality assurance
High-end (25G signal rate,), complex (70000 PIN, 34-layer PCB), large size PCBA (1200*510mm)
Rigid, flexible, soft and hard combination plate
01005, large size BGA (150mm*150mm), 180mm length SMD and other types of device capability
Complete end-to-end material and process quality data traceability
- Flexible collaboration model
CM, ODM, feed processing and other multi-mode production organization and manufacturing capacity
OEM, full OEM, partial OEM, VMI, material co-management and other types of end-to-end collaboration
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CNIT manufacturing - Single board
15 FUJI NXTIII AND GLOBAL MOUNT LINES
10 pallet wave soldering/selective wave soldering, plug-in repair soldering lines
Vitrox 810 EX/XLT、TRI 7600SIII 5DX/
Phoenix nanomelx 180 3D X-ray
Agilent 3070、Teradyne TSLX/Spectrum 88series、TRI MDA
5 UV/IR coating lines
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CNIT manufacturing - Complete machine
Assembly
Equipped with an assembly line for an in-line small clean room,
From small cassette products to 2U/4U/6U/8U servers
Micro module/power distribution cabinet/integrated cabinet and other large rack products
Test
Self-developed test equipment and test scripts
Multi-point FT/ST can be configured on demand, and 1000 ST test bits are dedicated to server products
Support local deployment of customer test network, and provide real-time docking/uploading of test data
Reliability
Equipped with an assembly line for an in-line small clean room,
12 ESS test chambers, 1 HASA/HALT test chamber
Two 119㎡ 64㎡ independent aging rooms, supporting a temperature range of 40-90°C
CNIT manufacturing - Process
Project | Ability | ||
PCB Size | Long | 50 ~ 900mm | |
Width | 50 ~ 600mm | ||
Thick | 0.508 ~ 6.0mm | ||
PCBA Weight | SMT | ≤ 6kg | |
Patch | Weight | Device weight/Adsorption area | ≤ 0.288g/mm² |
Device maximum weight | ≤ 255g | ||
Size | Minimum size | 1005 | |
Size range of machined components | 0.25*0.125 mm² --102*102 mm² | ||
Special Insert machine | Maximum cartridge pressure (N) | 98N | |
Pluggable devices | VGA interface,USBSocket, pin, all kinds of shaped parts,DIMM, switch buttons, high-speed communication ports, network port connectors,PCIESocket etc | ||
Maximum size of pluggable devices (L*W*H) | 145mm*26mm*45mm | ||
Plug-in accuracy tolerance (mm) | ± 0.TestVeneer processComplete line configuration SPI, 3D AOI, AXIBoard functionICT: supports 7680 test points MDA: supports 1280 test points BSI: customizes test items and parameters according to customer requirements FBT: customizes test items and parameters according to customer requirementsServer/Network products/Other productsFT/ST: Customized test items and parameters according to customer requirements HASA: temperature -40℃~80℃, rapid temperature change up to 40℃/min, vibration frequency 20Grms ESS: 9 sets, temperature -20℃~80℃, temperature change 10℃/min linear ORT/Burn-in: A total of 2 sets, high temperature 40~55 degrees, according to customer needs to determine the test time |
CNIT manufacturing - Quality
Cloud tip manufacturing - equipment
SMT production line has the most complete process/equipment configuration, using the industry's mainstream first-line brands, according to customer needs to set up product lines
Cloud tip manufacturing - equipment
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Self-energy
Bunker system -
Auto
Steel mesh
Inspection machine -
Brain power
Nozzle
Cleaning machine -
Mount head
Automatic
Maintenance machine -
X-RAY
Material dispenser